Perhimpunan PCB
Nearly 15-year Experience of Electronics Manufacturing
SATECH menyediakan perkhidmatan pemasangan PCB sehenti untuk pembuatan elektronik, daripada sumber komponen, Pengeluaran PCB, SMT, DIP, Pemasangan PCB kepada pemasangan produk siap. Dengan keunggulan pembelian secara besar-besaran (daripada IC, rintangan, kemuatan, kearuhan, diod dan audion,dan lain-lain.) dan kualiti-rasa pertama, kami membuat kontrak dengan pengeluar komponen yang sangat baik dari rumah dan di atas kapal untuk membina perkongsian jangka panjang, ini memastikan kualiti asli dan bekalan yang stabil, bertujuan untuk menyampaikan manfaat kepada pelanggan kami. Kami telah bekerja untuk pelanggan dari AS, Jerman, Rusia, Yaman, UAE, Jepun, Sepanyol, Perancis, Itali, Israel, Iran, India, Mexico, Argentina, Colombia, dan lain-lain.
Turnkey PCB Board Assembly Solutions
- Rapid Turnaround
- Prototype/Production Support
- Blank Boards » Components » Assembly
- Rapid On-line Quote
Since starting in 2003, SATECH has emerged as a trustworthy electronic contract manufacturer (ECM) to meet the demand of fast turnkey PCB assembly solutions. No matter whether it is a sample order or bulk order, we are always effective at reviewing and analyzing BOM and technical files, and quick to source components for rapid quotation. For the production and QC steps, some strict rules and regulations and KPI are available for every facility manager and worker. No quality for you, no life for us.
| Ability of manufacturing | PCB Assembly Service | Facility List |
|---|---|---|
| 4 SMT processing lines | Circuit board production (sehingga 12 lapisan, impedance, HDI, dan lain-lain.) | Fuji CP8 Series Surface-mount Machine |
| 3 DIP processing lines | SMT/DIP | Automated solder-paste printer |
| 0201 components assy | ICT (In-Circuit Test) | 10-zone Re-flow Soldering |
| 0.25mm BGA | FCT (Functional Circuit Test) | AOI Detector |
| Surface-mount 4 million pins/day | BIT (Burn-in Test) | Wave-soldering |
| DIP 1 million pins/day | Box Building | ICT Working Platform |
Supported PCB Assembly Capabilities
- THD (Thru-Hole Device)
- SMT (Surface-Mount Technology)
- SMT & THD combined
- 2-sided SMT and THD assembly
- 1 kepada 5,000 boards
- Passives parts, smallest size 0201
- Fine pitch to 8 Mils
- BGA, uBGA, QFN, POP and Zero-Lead chips
- Connectors and terminals
- Reels
- Cut tape
- Tube and tray
- Loose parts and bulk
- Minimum measurement: 0.2″ x 0.2″ (5mm x 5mm)
- Largest dimension: 15″ x 20″ (381mm x 508mm)
- Oblong
- Round
- Slots and Cut outs
- Complicated and Uncommon
- Rigid FR-4 boards
- Rigid-Flex boards
- Leaded process
- Zero-Lead (RoHS)
- Gerber RS-274X, 274D, Eagle as well as AutoCAD’s DXF, DWG
- BOM (Bill of Materials) (.xls, .csv, . xlsx)
- Centroid (Pick-N-Place Or XY file)
- Visual Inspection
- X-ray Inspection
- AOI (Also known as: Automated Optical Inspection)
- ICT (AKA: In-Circuit Test)
- Functional testing
- 1 To 5 days for only printed circuit board assy
- 10 To16 days for full Turnkey Circuit Card Assy
