SATECH Provides High-level Service of Surface Mount Technology
2017/3/3Tony CHENG from SATECH444

SMT (Surface Mount Technology), like other SMD Soldering and PCB assembly technology is not ZERO-Defect soldering process. Virtually all of today’s mass produced electronics hardware is manufactured using surface mount technology(SMT). The associated surface mount devices, SMDs provide many advantages over their leaded predecessors in terms of manufacturability and often performance.


A printed circuit board, or PCB, is an integral part of electronics. A PCB is basically a substrate (normally made from glass epoxy) with conductive traces etched from copper sheets. These copper traces facilitate flow of electricity. Electronic components are soldered along this conductive pathway thus controlling the flow and quantity of electricity needed.

A Printed Circuit Board is also known as Printed Wiring Board (PWB). When all the electronic components are soldered on a PCB, it is called a Printed Circuit Assembly or PCA and sometimes PCBA (Printed Circuit Board Assembly).

Printed Circuit Board (PCB) for Surface Mounting (SMT)

Printed Circuit Board (PCB) for Surface Mount Technology (SMT) need to be chosen wisely taking into consideration factors such as CTE (Coefficient of Thermal Expansion), cost, dielectric properties and Tg.

When designing surface mounting board (PCB), the selection of substrate is basically determined by the type of SMD components to be used. In any Electronics manufacturing or PCB assembly, when leadless ceramic chip carriers (LCCC) are mounted on printed circuit boards made out of glass epoxy substrates, solder joints cracking is generally seen about 100 cycles. The cause of the excessive stress is the CTE differential between the ceramic package and the glass epoxy substrate.

The most widely used substrate for SMT Printed Circuit Boards, is glass epoxy. It entails no CTE compatibility problems when used for plastic surface mount packages. However, This provides the solution for commercial applications only.

The most commonly used substrate for PCBs for military applications is one with a CTE value compatible with that of the ceramic packages that has been specified. Each PCB substrate option has its own advantages and disadvantages. Designers need to be carefully balances the constraints of cost with reliability and performance needs. In addition, solder masks and via hole sizes should be selected carefully.

Finally, SATECH offers world-class quality Electronic Manufacturing Services (EMS) in conjunction with outstanding individual customer service tailored to each customer’s needs. The ability to assist in all stages of production and a product life cycle allow SMT to provide value added solutions that can improve product time to market, increase quality levels all while reducing total cost. Select above to learn more about SMT's capabilities, quality, offshore production, PCBA, electronic assembly, and re-manufacturing services.